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High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device

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High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device

Place of Origin : China

MOQ : Negotiable

Price : Negotiable

Payment Terms : T/T

Supply Ability : 100000pc/Month

Delivery Time : 4 Weeks

Packaging Details : PCB + Box

Brand Name : CUSTOM MADE

Certification : ISO/UL

Keyword : PCB Board Design

Applications : Automotive Electronics, Communications, Internet, Consumer Electronics, Battery Pack, PCBA Circuit Board

Surface Finished : HASL Pb Free Immersion Gold/Silver Osp,Immersion Gold+OSP

Copper Thickness : 0.3-12 oz

Min Outline Tolerance : ±0.1mm

Special Capability : Gold Finger Plating, Carbon ink

Thickness : 0.5-17.5mm

Materials : High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872

Payment Method : T/T

Whether to Support customization : Support

Logistics : Accept customer specified logistics

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Designability Flexible Boards PCB Board Design Electronics Device High - Tg FR4

Prototype PCB Assembly Description:

1. Focus on component sourcing.
2. Management team with 10+ years of experience in the material.
3. PCB Component Sourcing Teams: Project department, Engineering department, Purchasing.
4. department, Quality department, Customs Declaration department.
5. Professional component validation engineers.
6. Professional BOM Engineers.

Prototype PCB Assembly Parameters:

Item Technical Parameter
Layer 2-64
Thickness 0.3-6.5mm
Copper Thickness 0.3-12 oz
Min Mechanical Hole 0.1mm
Min Laser Hole 0.075mm
HDI 1+n+1,2+n+2,3+n+3
Max Aspect Ratio 20:01
Max Board Size 650mm*1130mm
Min Width/Space 2.4/2.4mil
Min Outline Tolerance ±0.1mm
Impedance Tolerance ±5%
Min PP Thickness 0.06mm
Bow &Twist ≤0.5%
Materials FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
Surface Finished HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special Capability Gold Finger Plating, Peelable, Carbon ink

Prototype PCB Assembly Introduction:

The design of the printed circuit board is based on the circuit schematic diagram to realize the functions required by the circuit designer. The design of the printed circuit board mainly refers to the layout design, and the layout of external connections needs to be considered. Various factors such as the optimal layout of internal electronic components, the optimal layout of metal connections and vias, electromagnetic protection, heat dissipation, etc. Excellent layout design can save production costs and achieve good circuit performance and heat dissipation performance. Simple layout design can be realized by hand, and complex layout design needs to be realized by computer-aided design (CAD).High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device


Product Tags:

High Tg FR4 PCB Board Design

      

FR4 PCB Board Design Flexible

      

PCB Multi Layer Board Electronics

      
Quality High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device for sale

High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device Images

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